科技报告详细信息
MIL-PRF-19500 Appendix J: Inclusion of Plastic Encapsulated Discrete Semiconductor Devices forMilitary Applications Task Group
Damron, Benny ; Dillon, Ronan
关键词: ACOUSTIC MICROSCOPES;    AMBIENT TEMPERATURE;    CHIPS (ELECTRONICS);    ENCAPSULATED MICROCIRCUITS;    HERMETIC SEALS;    HIGH TEMPERATURE;    MICROELECTRONICS;    MILITARY TECHNOLOGY;    OPERATING TEMPERATURE;    PERFORMANCE TESTS;    SEMICONDUCTOR DEVICES;    SEMICONDUCTORS (MATERIALS);   
RP-ID  :  M19-7326
学科分类:电子与电气工程
美国|英语
来源: NASA Technical Reports Server
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