Modular Apparatus and Method for Attaching Multiple Devices

Okojie, Robert S [Inventor]

关键词: HIGH TEMPERATURE;    ELECTRONIC EQUIPMENT;    PATENTS;   

RP-ID  :  US-Patent-10,067,025, US-Patent-Appl-SN-14/698,018

美国|英语

来源: NASA Technical Reports Server

【 摘 要 】

A modular apparatus for attaching sensors and electronics is disclosed. The modular apparatus includes a square recess including a plurality of cavities and a reference cavity such that a pressure sensor can be connected to the modular apparatus. The modular apparatus also includes at least one voltage input hole and at least one voltage output hole operably connected to each of the plurality of cavities such that voltage can be applied to the pressure sensor and received from the pressure sensor.