Design of Experiments to Determine Causes of Flex Cable Solder Wicking, Discoloration and Hole Location Defects

Wolfe, Larry

Kansas City Plant (KCP), Kansas City, MO

关键词: Holes;    42 Engineering;    Cleaning;    Design;    Manufacturing;   

DOI  :  10.2172/952623
RP-ID  :  KCP-613-8569
RP-ID  :  DE-AC04-01AL66850
RP-ID  :  952623

美国|英语

来源: UNT Digital Library

【 摘 要 】

Design of Experiments (DoE) were developed and performed in an effort to discover and resolve the causes of three different manufacturing issues; large panel voids after Hot Air Solder Leveling (HASL), cable hole locations out of tolerance after lamination and delamination/solder wicking around flat flex cable circuit lands after HASL. Results from a first DoE indicated large panel voids could be eliminated by removing the pre-HASL cleaning. It also revealed eliminating the pre-HASL bake would not be detrimental when using a hard press pad lamination stackup. A second DoE indicated a reduction in hard press pad stackup lamination pressure reduced panel stretch in the y axis approximately 70%. A third DoE illustrated increasing the pre-HASL bake temperature could reduce delamination/solder wicking when using a soft press pad lamination stackup.