Assessing the RELAPS-3D Heat Conduction Enclosure Model

McCann, Larry D.

Bettis Atomic Power Laboratory

关键词: 42 Engineering;    Thermal Conduction;    R Codes;    Exact Solutions;    97;   

DOI  :  10.2172/940232
RP-ID  :  B-T-3741
RP-ID  :  DE-AC11-98-PN38206
RP-ID  :  940232

美国|英语

来源: UNT Digital Library

【 摘 要 】

Three heat conduction problems that have exact solutions are modeled with RELAP5-3D using the conduction enclosure model. These comparisons are designed to be used in the RELAP5-3D development assessment scheduled to be completed in 2009. It is shown that with proper input choices and adequate model detail the exact solutions can be matched. In addition, this analysis identified an error and the required correction in the cylindrical and spherical heat conductor models in RELAP5-3D which will be corrected in a future version of RELAP5-3D.