Mechanical Behavior of Grain Boundary Engineered Copper

Carter, S B ; Hodge, A M

Lawrence Livermore National Laboratory

关键词: Copper;    Mechanical Properties;    Diffraction;    36 Materials Science;    Orientation;   

DOI  :  10.2172/929157
RP-ID  :  UCRL-TR-223635
RP-ID  :  W-7405-ENG-48
RP-ID  :  929157

美国|英语

来源: UNT Digital Library

【 摘 要 】

A grain boundary engineered copper sample previously characterized by Electron Backscatter Diffraction (EBSD) has been selected for nanoindentation tests. Given the fact that grain boundaries have thicknesses in the order of 1 micron or less, it is essential to use nanomechanics to test the properties of individual grain boundaries. The Hysitron nanoindenter was selected over the MTS nanoindenter due to its superior optical capabilities that aid the selection and identification of the areas to be tested. An area of 2mm by 2mm with an average grain size of 50 microns has been selected for the study. Given the EBSD mapping, grains and grain boundaries with similar orientations are tested and the hardness and modulus are compared. These results will give a relationship between the mechanical properties and the engineered grain boundaries. This will provide for the first time a correlation between grain boundary orientation and the mechanical behavior of the sample at the nanoscale.