Joining of Tungsten Armor Using Functional Gradients

O' ; Dell, John Scott

Plasma Processes, Inc.

关键词: Copper;    42 Engineering;    Armor;    Testing;    Heat Flux;   

DOI  :  10.2172/896793
RP-ID  :  DE-FG02-96ER82257
RP-ID  :  FG02-96ER82257
RP-ID  :  896793

美国|英语

来源: UNT Digital Library

【 摘 要 】

The joining of low thermal expansion armor materials such as tungsten to high thermal expansion heat sink materials has been a major problem in plasma facing component (PFC) development. Conventional planar bonding techniques have been unable to withstand the high thermal induced stresses resulting from fabrication and high heat flux testing. During this investigation, innovative functional gradient joints produced using vacuum plasma spray forming techniques have been developed for joining tungsten armor to copper alloy heat sinks. A model was developed to select the optimum gradient architecture. Based on the modeling effort, a 2mm copper rich gradient was selected. Vacuum plasma pray parameters and procedures were then developed to produce the functional gradient joint. Using these techniques, dual cooling channel, medium scale mockups (32mm wide x 400mm length) were produced with vacuum plasma spray formed tungsten armor. The thickness of the tungsten armor was up to 5mm thick. No evidence of debonding at the interface between the heat sink and the vacuum plasma sprayed material was observed.