Final Progress Report: FRACTURE AND SUBCRITICAL DEBONDING IN THIN LAYERED STRUCTURES: EXPERIMENTS AND MULTI-SCALE MODELING

Dauskardt, Reinhold H.

Stanford University

关键词: Crack Propagation;    Microelectronic Circuits Adhesion, Thin Films, Mechanics, Nanomaterials, Environment;    Adhesion, Thin Films, Mechanics, Nanomaterials, Environment;    Computerized Simulation;    36 Materials Science;   

DOI  :  10.2172/877945
RP-ID  :  DOE/ER/45543-3
RP-ID  :  FG03-95ER45543
RP-ID  :  877945

美国|英语

来源: UNT Digital Library

【 摘 要 】

Final technical report detailing unique experimental and multi-scale computational modeling capabilities developed to study fracture and subcritical cracking in thin-film structures. Our program to date at Stanford has studied the mechanisms of fracture and fatigue crack-growth in structural ceramics at high temperature, bulk and thin-film glasses in selected moist environments where we demonstrated the presence of a true mechanical fatigue effect in some glass compositions. We also reported on the effects of complex environments and fatigue loading on subcritical cracking that effects the reliability of MEMS and other micro-devices using novel micro-machined silicon specimens and nanomaterial layers.