Thin film adhesion by nanoindentation-induced superlayers. Final report

Gerberich, William W. ; Volinsky, A. A.

University of Minnesota. Department of Chemical Engineering and Materials Science.

关键词: Layers;    75 Condensed Matter Physics, Superconductivity And Superfluidity;    Stresses;    36 Materials Science;    Progress Report;   

DOI  :  10.2172/809372
RP-ID  :  DOE/ER/45574--1
RP-ID  :  FG02-96ER45574
RP-ID  :  809372

美国|英语

来源: UNT Digital Library

【 摘 要 】

This work has analyzed the key variables of indentation tip radius, contact radius, delamination radius, residual stress and superlayer/film/interlayer properties on nanoindentation measurements of adhesion. The goal to connect practical works of adhesion for very thin films to true works of adhesion has been achieved. A review of this work titled ''Interfacial toughness measurements of thin metal films,'' which has been submitted to Acta Materialia, is included.