Slicing of silicon ingots with reduced kerf. Final report (Phase II)

Schmid, F. ; Smith, M. ; Schmid, K. ; Khattak, C.P.

Crystal Systems, Inc., Salem, MA (United States)

关键词: Abrasives;    Bladepacks;    Wafering;    36 Materials Science;    Crystal Slicing;   

DOI  :  10.2172/806473
RP-ID  :  NONE
RP-ID  :  FG02-95ER81949
RP-ID  :  806473

美国|英语

来源: UNT Digital Library

【 摘 要 】

The Fixed Abrasive Slicing Technique (FAST) has been developed as an effective wafering technique by combining the advantages of diamond as an abrasive like internal diamond (ID), a reciprocating bladehead as in Multi-Blade Slurry (MBS) and wire slicing as in multiwire slicing (MWS) techniques. During the development stage, it was necessary to develop a slicer, bladepacks and the technique. It was recognized that high pressures were required between the diamond abrasive and the crystal to achieve effective slicing. This was achieved by rocking the workpiece to minimize the contact length. During the present work, the cutting effectiveness was enhanced by increasing the rotary speed of the crystal in the range of 2,500 to 5,000 rpm and the reciprocating rate of the bladehead to about 100 cycles/minute. The combination of high speed rotation of the crystal and FAST slicing have produced more effective slicing by increasing the cutting rate by a factor of 50 to produce multiple wafers wit h low kerf, low surface damage and high accuracy. In addition, this technique is now applicable for soft as well as very hard crystals. Based on these developments, Crystal Systems is currently commercializing FAST for slicing of a wide variety of hard and soft crystals.