Microscale Modeling and Simulation

REDMOND, JAMES M. ; REEDY JR., EARL DAVID ; HEINSTEIN, MARTIN W. ; DE BOER, MAARTEN P. ; KNAPP, JAMES A. ; PIEKOS, EDWARD S. ; WONG, CHUNGNIN C. ; HOLM, ELIZABETH A.

Sandia National Laboratories

关键词: Surfaces;    Adhesives;    99 General And Miscellaneous//Mathematics, Computing, And Information Science;    Electrostatics;    Computerized Simulation;   

DOI  :  10.2172/791899
RP-ID  :  SANAD2001-3675
RP-ID  :  AC04-94AL85000
RP-ID  :  791899

美国|英语

来源: UNT Digital Library

【 摘 要 】

The Microsystems Subgrid Physics project is intended to address gaps between developing high-performance modeling and simulation capabilities and microdomain specific physics. The initial effort has focused on incorporating electrostatic excitations, adhesive surface interactions, and scale dependent material and thermal properties into existing modeling capabilities. Developments related to each of these efforts are summarized, and sample applications are presented. While detailed models of the relevant physics are still being developed, a general modeling framework is emerging that can be extended to incorporate evolving material and surface interaction modules.