The Mechanics of Creep Deformation in Polymer Derived Continuous Fiber-Reinforced Ceramic Matrix Composites

Lara-Curzio, E.

Oak Ridge National Laboratory

关键词: Stress Relaxation;    Fibers;    Polymers;    36 Materials Science;    Composite Materials;   

DOI  :  10.2172/777651
RP-ID  :  C/ORNL93-0242
RP-ID  :  AC05-96OR22464
RP-ID  :  777651

美国|英语

来源: UNT Digital Library

【 摘 要 】

The objective of this Cooperative Research and Development Agreement between Lockheed Martin Energy Research Corporation and Dow Corning Corporation was to study the effects of temperature, stress, fiber type and fiber architecture on the time-dependent deformation and stress-rupture behavior of polymer-derived ceramic matrix composites developed by the Dow Corning Corporation. Materials reinforced with CG-Nicalon{trademark}, Hi-Nicalon{trademark} and Sylramic{reg_sign} fibers were evaluated under fast fracture, stress-relaxation, and stress-rupture conditions at temperatures between 700 C and 1400 C in ambient air and for stresses between 50 and 200 MPa. Some of the stress-rupture tests conducted as part of this program are among the longest-duration experiments ever conducted with these materials. The possibility of using accelerated test techniques to evaluate the very-long term stress-rupture/creep behavior of these materials was investigated by means of stress-relaxation experiments. However it was found that because these materials exhibit non-linear stress-strain behavior at stresses larger than the matrix cracking stress and because of environmentally-induced changes in the micro and mesostructure of the material, particularly at elevated temperatures, this approach is impractical. However, the results of stress-relaxation experiments will be useful to predict the behavior of these materials in applications where stresses are thermally-induced and therefore driven by strains (e.g., when components are subjected to thermal gradients). The evolution of the microstructure of the fibers, matrix and fiber-matrix interface was studied as a function of stress and temperature, using analytical electron microscopy. The results from these analyses were essential to understand the relationships between environment, stress, temperature and processing on the microstructure and properties of these materials.