Plasma-material Interactions in Current Tokamaks and their Implications for Next-step Fusion Reactors

Federici, G. ; Skinner, C.H. ; Brooks, J.N. ; Coad, J.P. ; Grisolia, C.

Princeton University. Plasma Physics Laboratory.

关键词: Thermonuclear Reactors;    70 Plasma Physics And Fusion Technology;    Experimental Reactors;    Deuterium;    Tritium;   

DOI  :  10.2172/773280
RP-ID  :  PPPL-3531
RP-ID  :  AC02-76CH03073
RP-ID  :  773280

美国|英语

来源: UNT Digital Library

【 摘 要 】

The major increase in discharge duration and plasma energy in a next-step DT [deuterium-tritium] fusion reactor will give rise to important plasma-material effects that will critically influence its operation, safety, and performance. Erosion will increase to a scale of several centimeters from being barely measurable at a micron scale in today's tokamaks. Tritium co-deposited with carbon will strongly affect the operation of machines with carbon plasma-facing components. Controlling plasma wall interactions is critical to achieving high performance in present-day tokamaks and this is likely to continue to be the case in the approach to practical fusion reactors. Recognition of the important consequences of these phenomena has stimulated an internationally coordinated effort in the field of plasma-surface interactions supporting the Engineering Design Activities of the International Thermonuclear Experimental Reactor (ITER) project and significant progress has been made in better under standing these issues. This paper reviews the underlying physical processes and the existing experimental database of plasma-material interactions both in tokamaks and laboratory simulation facilities for conditions of direct relevance to next-step fusion reactors. Two main topical groups of interactions are considered: (i) erosion/redeposition from plasma sputtering and disruptions, including dust and flake generation, (ii) tritium retention and removal. The use of modeling tools to interpret the experimental results and make projections for conditions expected in future devices is explained. Outstanding technical issues and specific recommendations on potential R and D [Research and Development] avenues for their resolution are presented.