Effect of nanoscale patterned interfacial roughness on interfacial toughness.

Zimmerman, Jonathan A. ; Moody, Neville Reid ; Mook, William M. (University of Minnesota, Minneapolis, MN) ; Kennedy, Marian S. (Clemson University, Clemson, SC) ; Bahr, David F. (Washington State University, Pullman, WA) ; Zhou, Xiao Wang ; Reedy, Earl David,

关键词: NANOSTRUCTURES;    INTERFACES;    CRACK PROPAGATION;    FRACTURE PROPERTIES;    PERFORMANCE;    RELIABILITY;    ROUGHNESS;    SILICON;    THIN FILMS;    TEXTURE;    FINITE ELEMENT METHOD Interfaces (Physical sciences);    Surfaces and Interfaces;    Thin Films;    Nanostr;   

DOI  :  10.2172/920765
RP-ID  :  SAND2007-5990
PID  :  OSTI ID: 920765
Others  :  TRN: US200803%%19

学科分类：材料科学（综合）

美国|英语

来源: SciTech Connect

【 摘 要 】

The performance and the reliability of many devices are controlled by interfaces between thin films. In this study we investigated the use of patterned, nanoscale interfacial roughness as a way to increase the apparent interfacial toughness of brittle, thin-film material systems. The experimental portion of the study measured the interfacial toughness of a number of interfaces with nanoscale roughness. This included a silicon interface with a rectangular-toothed pattern of 60-nm wide by 90-nm deep channels fabricated using nanoimprint lithography techniques. Detailed finite element simulations were used to investigate the nature of interfacial crack growth when the interface is patterned. These simulations examined how geometric and material parameter choices affect the apparent toughness. Atomistic simulations were also performed with the aim of identifying possible modifications to the interfacial separation models currently used in nanoscale, finite element fracture analyses. The fundamental nature of atomistic traction separation for mixed mode loadings was investigated.