Assessing the RELAPS-3D Heat Conduction Enclosure Model

McCann, Larry D.

关键词: 97;    EXACT SOLUTIONS;    R CODES;    THERMAL CONDUCTION;    CORRECTIONS;   

DOI  :  10.2172/940232
RP-ID  :  B-T-3741
PID  :  OSTI ID: 940232
Others  :  TRN: US200823%%705

学科分类：工程和技术（综合）

美国|英语

来源: SciTech Connect

【 摘 要 】

Three heat conduction problems that have exact solutions are modeled with RELAP5-3D using the conduction enclosure model. These comparisons are designed to be used in the RELAP5-3D development assessment scheduled to be completed in 2009. It is shown that with proper input choices and adequate model detail the exact solutions can be matched. In addition, this analysis identified an error and the required correction in the cylindrical and spherical heat conductor models in RELAP5-3D which will be corrected in a future version of RELAP5-3D.