科技报告详细信息
High Performance Packaging Solutions for Low Cost, Reliable PV Modules: Final Subcontract Report, 26 May 2005 - 30 November 2008 | |
Keotla, B. M. ; Marinik, B. J. | |
关键词: CAPACITY; MANUFACTURING; PACKAGING; PERFORMANCE; RELIABILITY PV; HIGH PERFORMANCE; PACKAGING SOLUTION; LOW COST; RELIABILITY; MODULES; MANUFACTURER; CRYSTALLINE SILICON; ETHYL VINYL ACETATE; POLY VINYL FLUORIDE; Solar Energy - Photovoltaics; | |
DOI : 10.2172/958223 RP-ID : NREL/SR-520-45903 PID : OSTI ID: 958223 Others : Other: ZAX-5-33628-02 Others : TRN: US201001%%503 |
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美国|英语 | |
来源: SciTech Connect | |
【 摘 要 】
During this research effort, Dow Corning Corporation has addressed the PV manufacturing goals of: (i) improving PV manufacturing processes and equipment; (ii) accelerating manufacturing cost reductions of PV modules; (iii) increasing commercial product performance and reliability; and (iv) scaling up U.S. manufacturing capacity.
【 预 览 】
Files | Size | Format | View |
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RO201705170001875LZ | 1021KB | download |