International Round-Robin Testing of Bulk Thermoelectrics

Wang, Hsin¹  Porter, Wallace D¹  Bottner, Harold²  Konig, Jan²  Chen, Lidong³  Bai, Shengqiang³  Tritt, 

[1] ORNL;Fraunhofer-Institute, Freiburg, Germany;Chinese Academy of Sciences

关键词: ELECTRIC CONDUCTIVITY;    PROBABILITY;    RELIABILITY;    SPECIFIC HEAT;    TESTING;    THERMAL DIFFUSIVITY;    THERMOELECTRIC MATERIALS;    TRANSPORT thermoelectric;    round-robin;   

DOI  :  10.2172/1049790
RP-ID  :  ORNL/TM-2011/393
PID  :  OSTI ID: 1049790
Others  :  Other: VT0504000
Others  :  CEVT004
Others  :  TRN: US201218%%609

学科分类：材料科学（综合）

美国|英语

来源: SciTech Connect

【 摘 要 】

Two international round-robin studies were conducted on transport properties measurements of bulk thermoelectric materials. The study discovered current measurement problems. In order to get ZT of a material four separate transport measurements must be taken. The round-robin study showed that among the four properties Seebeck coefficient is the one can be measured consistently. Electrical resistivity has +4-9% scatter. Thermal diffusivity has similar +5-10% scatter. The reliability of the above three properties can be improved by standardizing test procedures and enforcing system calibrations. The worst problem was found in specific heat measurements using DSC. The probability of making measurement error is great due to the fact three separate runs must be taken to determine Cp and the baseline shift is always an issue for commercial DSC. It is suggest the Dulong Petit limit be always used as a guide line for Cp. Procedures have been developed to eliminate operator and system errors. The IEA-AMT annex is developing standard procedures for transport properties testing.