Analytical Study on Thermal and Mechanical Design of Printed Circuit Heat Exchanger

Su-Jong Yoon ; Piyush Sabharwall ; Eung-Soo Kim

关键词: Advanced High Temperature Reactor;    Log Mean Temperature Difference;    Printed Circuit Heat Exchanger;    Small Modular Reactor;   

DOI  :  10.2172/1116746
RP-ID  :  INL/EXT-13-30047
PID  :  OSTI ID: 1116746

学科分类：工程和技术（综合）

美国|英语

来源: SciTech Connect

【 摘 要 】

The analytical methodologies for the thermal design, mechanical design and cost estimation of printed circuit heat exchanger are presented in this study. In this study, three flow arrangements of parallel flow, countercurrent flow and crossflow are taken into account. For each flow arrangement, the analytical solution of temperature profile of heat exchanger is introduced. The size and cost of printed circuit heat exchangers for advanced small modular reactors, which employ various coolants such as sodium, molten salts, helium, and water, are also presented.