Synthesis, characterization, and high potential of 3D metal-organic framework (MOF) nanoparticles for curing with epoxy

JOURNAL OF ALLOYS AND COMPOUNDS

卷:829

Article

Jouyandeh, Maryam^1,2  Tikhani, Farimah³  Shabanian, Meisam⁴  Movahedi, Farnaz⁴  Moghari, Shahab³  Akbari, Vahideh⁵  Gabrion, Xavier⁶  Laheurte, Pascal⁷  Vahabi, Henri^1,2  Saeb, Mohammad Reza⁵ 

[1] Univ Lorraine, LMOPS, Cent Supelec, F-57000 Metz, France

[2] Univ Paris Saclay, Lab Mat Opt Photon & Syst, Cen Supelec, F-57070 Metz, France

[3] Univ Tehran, Coll Engn, Sch Chem Engn, Tehran 111554563, Iran

[4] SRI, Fac Chem & Petrochem Engn, POB 31745-139, Karaj, Iran

[5] Inst Color Sci & Technol, Dept Resin & Addit, POB 16765-654, Tehran, Iran

[6] Univ Bourgogne Franche Comte, FEMTO ST Inst, UFC CNRS ENSMM UTBM, Dept Appl Mech, F-25000 Besancon, France

[7] Univ Lorraine, Lab LEM3, UMR 7239, F-57045 Metz, France

关键词: Epoxy;    Cure Index;    3D nanoparticles;    Metal-organic framework (MOF);   

DOI  :  10.1016/j.jallcom.2020.154547

来源: Elsevier

【 摘 要 】

In this study, the potential of microporous 3D metal-organic framework (MOF) for curing epoxy resin has been discussed. First, MIL-101 (Cr), a chromium based MOF, was synthesized under hydrothermal condition and then characterized by using Fourier transform infrared (FTIR) spectroscopy, X-ray diffraction (XRD) and thermogravimetric (TGA) measurements. Epoxy nanocomposites containing 0.1, 0.3 and 0.5 wt% of MOF nanocrystals were subsequently prepared and their curability was studied in terms of the universal dimensionless Cure Index (CI) criterion under nonisothermal differential scanning calorimetry (DSC). Based on calculations made on the basis of the CI, epoxy nanocomposites containing 0.1, 0.3, and 0.5 wt% of MOF were labeled Good and Excellent thanks to an enhanced chemical interaction between MOF and epoxy matrix, where the heat of cure in the system was surprisingly even higher than that of the neat epoxy. It was demonstrated that introduction of MOF into epoxy significantly improved the heat release during crosslinking process of epoxy, as indicated by a 63% rise in the enthalpy of cure at MOF loading of 0.1 wt%. Addition of thermally stable MOF nanomaterials to the epoxy resin improved thermal decomposition resistance of epoxy. Up to 0.3 wt% loading, the system revealed acceptable thermal stability at elevated temperature featured by more residue remained at the end of test, while sample containing 0.5 wt% MOF resisted against decomposition at early stages of degradation due to higher thermal stability of MOF with respect to epoxy resin. (C) 2020 Elsevier B.V. All rights reserved.

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