Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: Microstructure, resistivity, oxidation resistance, and long-term stability

JOURNAL OF ALLOYS AND COMPOUNDS

卷:732

Article

Li, Wanli^1,2  Li, Lingying^1,2  Gao, Yue^1,2  Hu, Dawei^1,2  Li, Cai-Fu²  Zhang, Hao²  Jiu, Jinting^2,3  Nagao, Shijo²  Suganuma, Katsuaki² 

[1] Osaka Univ, Grad Sch Engn, Dept Adapt Machine Syst, Yamadaoka 2-1, Suita, Osaka, Japan

[2] Osaka Univ, Inst Sci & Ind Res, Mihogaoka 8-1, Ibaraki, Osaka 5670047, Japan

[3] Senju Met Ind Co Ltd, Adachi Ku, Senju Hashido Cho 23, Tokyo 1208555, Japan

关键词: Cu ink;    Submicron Cu particles;    Cu nanoparticles;    Thermal stability;    Oxidation behaviors;    Printed electronics;   

DOI  :  10.1016/j.jallcom.2017.10.193

来源: Elsevier

【 摘 要 】

Submicron Cu particles mixed with Cu complex are used successfully to fabricate highly conductive Cu films for printed electronics. This study investigates the effects of Cu particle size on microstructure, conductivity and on the long-term stability of printed Cu films. In particular, the oxidation behaviors of printed Cu films at high temperatures are studied from the evolutions in microstructure and chemical composition. The submicron Cu particles are sintered efficiently due to the help of in-situ formed Cu nanoparticles from the decomposition of the Cu complex. Low resistivity of 5.8 mu Omega cm is easily achieved. At temperatures of 140 degrees C and 180 degrees C, the printed Cu films prepared from 800 nm Cu particles are more stable than that from those 350 nm particles, which can be attributed to larger Cu particles possessing higher oxidation resistance. At 220 degrees C, the result becomes opposite because the loose structure with many large voids in the printed Cu films from large particles provides sufficient space for oxygen and accelerate the break of pathways between adjacent particles by the formation of Cu oxides layers. This indicates the long-term stability of printed Cu films is attributed to not only the intrinsic oxidation of Cu to Cu2O but also the degradation of microstructures. At all events, the printed Cu films from submicron Cu particles with Cu complex exhibit excellent oxidation resistance and are superior to those from Cu nanoparticles. This presents significant potential and favorable prospects for the fabrication of highly reliable and cost-effective printed electronics. (C) 2017 Elsevier B.V. All rights reserved.

【 授权许可】

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