Improvement of interfacial bonding and mechanical properties of Cu-Al2O3 composite by Cr-nanoparticle-induced interfacial modification

JOURNAL OF ALLOYS AND COMPOUNDS

卷:695

Article

Wang, Xueliang¹  Li, Jiarong¹  Zhang, Yan¹  Wang, Yaping^1,2 

[1] Xi An Jiao Tong Univ, MOE Key Lab Nonequilibrium Synth & Modulat Conden, Sch Sci, Xian 710049, Peoples R China

[2] Xi An Jiao Tong Univ, State Key Lab Mech Behav Mat, Xian 710049, Peoples R China

关键词: Mechanical property;    Interfacial bonding;    Residual stress;    Composite;   

DOI  :  10.1016/j.jallcom.2016.11.055

来源: Elsevier

【 摘 要 】

The strength and ductility of copper matrix composites are usually limited due to the interfacial debonding between the reinforcement and matrix. Interfacial debonding is mainly caused by the interfacial stress induced by the differences in elastic modulus and thermal expansion coefficient (CTE) between the reinforcement and matrix. Cu-Cr-Al2O3 composite with Cr nanoparticles precipitated at the interface of Cu and Al2O3 was fabricated. It was found that the hardness of Cu-1 wt% Cr-4 wt% Al2O3 composite is higher than that of Cu-5 wt% Al2O3 composite over the temperature range from 25 degrees C to 1000 degrees C. Notably, the hardness increment reached 133% at 1000 degrees C. In addition, the compressibility increased 36% for Cu-1 wt% Cr-4 wt% Al2O3 composite compared with Cu-5 wt% Al2O3. The finite element simulation results confirmed that the interfacial residual stress in Cu-Al2O3 composite decreased by adding Cr, resulting in the improvement in mechanical properties. (C) 2016 Elsevier B.V. All rights reserved.

【 授权许可】

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