Integrated electrochemical analysis of polyvinyl pyrrolidone (PVP) as the inhibitor for copper chemical mechanical planarization (Cu-CMP)

JOURNAL OF ALLOYS AND COMPOUNDS

卷:770

Article

Yang, Guang^1,2,3  Wang, Haixu^1,4  Wang, Ning¹  Sun, Rong^1,6  Wong, Ching-Ping^1,5 

[1] Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen 518055, Peoples R China

[2] Univ Sci & Technol China, Dept Nano Sci, Suzhou 215123, Peoples R China

[3] Univ Sci & Technol China, Technol Inst, Suzhou 215123, Peoples R China

[4] Shenzhen Univ, Coll Mat Sci & Engn, Shenzhen 518060, Peoples R China

[5] Chinese Univ Hong Kong, Dept Elect Engn, Hong Kong 999077, Hong Kong, Peoples R China

[6] Chinese Acad Sci, Shenzhen Inst Adv Technol, Guangdong Prov Key Lab Mat High Dens Elect Packag, Shenzhen 518055, Peoples R China

关键词: Chemical mechanical planarization;    Electrochemical impedance spectra;    Electrochemical noise;    Slurry;    Inhibitors;   

DOI  :  10.1016/j.jallcom.2018.08.101

来源: Elsevier

【 摘 要 】

Copper chemical mechanical planarization (Cu-CMP) is an essential procedure for the fabrication of integrated circuits (IC). The corrosion inhibitors in the Cu-CMP slurry could balance the over etching from the corrosion reagents to facilitate the global planarization of the copper layers. However, the normally used Cu-CMP inhibitor 1-benzotriazole (BTA) was toxic for the long time usage. In this paper, the biocompatible polyvinyl pyrrolidone (PVP) was proposed to substitute the BTA in the Cu-CMP. With an integrated electrochemical test, including the Tafel polarization, electrochemical impedance spectra (EIS), and the electrochemical noise (EN), it was found that the PVP could possess a good inhibition effect comparable to BTA, which opened up a promising way for the design of biocompatible inhibitors in the Cu-CMP. (C) 2018 Elsevier B.V. All rights reserved.

【 授权许可】

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