Novel Cu-RuNx composite layer with good solderability and very low consumption rate

JOURNAL OF ALLOYS AND COMPOUNDS

卷:504

Article

Chuang, H. Y.¹  Lin, C. H.²  Chu, J. P.³  Kao, C. R.¹ 

[1] Natl Taiwan Univ, Dept Mat Sci & Engn, Taipei 10764, Taiwan

[2] Chin Min Inst Technol, Dept Environm Engn, Miaoli Cty, Taiwan

[3] Natl Taiwan Univ Sci & Technol, Dept Polymer Engn, Taipei, Taiwan

关键词: Under bump metallurgy;    Surface finish;    Diffusion barrier;    Electronic packaging;   

DOI  :  10.1016/j.jallcom.2010.05.131

来源: Elsevier

【 摘 要 】

This letter reports a RuNx-bearing Cu layer that has the potential to replace both the wetting layer and the diffusion barrier layer in the conventional under bump metallurgy of flip-chip solder joints. This Cu-RuNx composite layer was deposited by reactive co-sputtering of Cu and Ru in N-2 atmosphere. Experimental characterizations show that Cu-RuNx exhibits comparable solderability to pure Cu. Most importantly, Cu-RuNx has a dissolution rate at least one order of magnitude slower than that of pure Cu. A single layer exhibiting these two attributes might offer substantial advantage in cost reduction. (C) 2010 Elsevier B.V. All rights reserved.

【 授权许可】

Free