An interaction energy integral method for nonhomogeneous materials with interfaces under thermal loading

INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES

卷:49

Article

Guo, Licheng¹  Guo, Fengnan¹  Yu, Hongjun¹  Zhang, Li¹ 

[1] Harbin Inst Technol, Dept Astronaut Sci & Mech, Harbin 150001, Peoples R China

关键词: Nonhomogeneous materials;    Interface;    Interaction energy integral method (IEIM);    Thermal stress intensity factors (TSIFs);   

DOI  :  10.1016/j.ijsolstr.2011.10.012

来源: Elsevier

【 摘 要 】

A plane crack problem of nonhomogeneous materials with interfaces subjected to static thermal loading is investigated. A modified interaction energy integral method (IEIM) is developed to obtain the mixed-mode thermal stress intensity factors (TSIFs). Compared with the previous IEIM, the original point of this paper is: the domain-independence of the modified IEIM still stands in nonhomogeneous materials with interfaces under thermal loading. Therefore, the modified IEIM can still be applied to obtain the TSIFs of nonhomogeneous material even if the integral domain includes interfaces. The modified IEIM is combined with the extended finite element method (XFEM) to solve several thermal fracture problems of nonhomogeneous materials. Good agreement can be obtained compared with the analytic solutions and the domain-independence of the IEIM is verified. Therefore, the present method is effective to study the TSIFs of nonhomogeneous materials even when the materials contain interfaces. The influence of the discontinuity of the material properties (thermal expansion coefficient, thermal conductivity and Young's modulus) on the TSIFs is investigated. The results show that the discontinuity of both thermal expansion coefficient and Young's modulus affects the TSIFs greatly, while the discontinuity of thermal conductivity does not arouse obvious change of the TSIFs. 2011 Elsevier Ltd. All rights reserved.

【 授权许可】

Free