Analysis of the multi-cracking mechanism of brittle thin films on elastic-plastic substrates

INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES

卷:180

Article

Ben Cheikh, I^1,2  Parry, G.¹  Dalmas, D.²  Estevez, R.²  Marthelot, J.^3,4 

[1] Univ Grenoble Alpes, SIMAP, Grenoble INP, CNRS, F-38000 Grenoble, France

[2] Ecole Cent Lyon, CNRS, LTDS, F-69134 Ecully, France

[3] CNRS, SVI, F-93303 Aubervilliers, France

[4] Aix Marseille Univ, IUSTI, CNRS, F-13013 Marseille, France

关键词: Multi-cracking;    Elasto-plasticity;    Thin films;    Compliant substrate;    Finite elements modeling;    Cohesive zone modeling;   

DOI  :  10.1016/j.ijsolstr.2019.07.026

来源: Elsevier

【 摘 要 】

Thin brittle films on compliant substrates are used in many applications, as soft electronics and solar cells. When submitted to large tensile strains,, those systems undergo multi cracking. A saturation of the cracks pattern is observed, i.e. no new crack is formed above a given nominal applied strain. Moreover, a characteristic distance between the cracks is observed at saturation. A mechanical analysis is carried out in this paper in order to quantitatively predict the saturation phenomenon. Fracture in the brittle layer, delamination at the interface and plasticity in the substrate are taken into account. The results of finite elements simulations show that both the plastic deformation pattern inside the substrate and the strength of the brittle layer are key elements for predicting the cracks pattern at saturation. (C) 2019 Elsevier Ltd. All rights reserved.

【 授权许可】

Free