Modeling of thermal expansion behavior of densely packed Al/SiC composites

INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES

卷:102

Article

Sharma, Neeraj Kumar¹  Misra, R. K.²  Sharma, Satpal² 

[1] BML Munjal Univ, Gurgaon 122413, India

[2] Gautam Buddha Univ, Greater 201306, Noida, India

关键词: Metal-matrix composites (MMCs);    Microstructures;    Thermal expansion;    Finite element analysis (FEA);    Plastic deformation;   

DOI  :  10.1016/j.ijsolstr.2016.10.015

来源: Elsevier

【 摘 要 】

In this paper the approach for finite element (FE) modeling and analysis of thermal expansion behavior of densely packed Al/SiC composites is proposed. The coefficient of linear thermal expansion (CTE) is predicted from 50 degrees C to 500 degrees C by considering temperature dependent linear elastic and elastoplastic matrix material behavior. Three dimensional representative volume elements (RVEs) are generated to model the composite's microstructures. In order to study the effect of thermal residual stresses, first the RVEs are simulated for cooling process from processing temperature to room temperature and thermal residual stresses are estimated by considering different mechanical behaviors of Al matrix. Next, the thermal expansion behavior is examined with existing residual stresses. The presence of thermal residual stresses is observed to influence the effective CTE in the initial temperature range (25 degrees C-100 degrees C) of heating. The contact state of reinforced particles significantly influences the thermal expansion behavior. It is observed that the effective CTE of composites with non-interpenetrating microstructure is higher than that of the composites having interpenetrating microstructure. The effects of voids on the thermal expansion behavior are analyzed further. (C) 2016 Elsevier Ltd. All rights reserved.

【 授权许可】

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