| JOURNAL OF POWER SOURCES | 卷:364 |
| Highly efficient and thickness-tolerable bulk heterojunction polymer solar cells based on P3HT donor and a low-bandgap non-fullerene acceptor | |
| Article | |
| Liu, Xiaodong1  Li, Yongxi3  Huang, Peng2  Zhou, Yi2  Jiang, Zuo-Quan3  Song, Bo2  Li, Yongfang2  Liao, Liang-Sheng3  Zheng, Yonghao1  | |
| [1] Univ Elect Sci & Technol China, Sch Optoelect Informat, Chengdu 610054, Sichuan, Peoples R China | |
| [2] Soochow Univ, Coll Chem Chem Engn & Mat Sci, Lab Adv Optoelect Mat, Suzhou, Jiangsu 215123, Peoples R China | |
| [3] Soochow Univ, Inst Funct Nano & Soft Mat FUNSOM, Jiangsu Key Lab Carbon Based Funct Mat & Devices, Suzhou 215123, Jiangsu, Peoples R China | |
| 关键词: Non-fullerene acceptor; Bulk heterojunction polymer solar cells; Thickness-insensitive performance; Thermal stability; Low-bandgap small molecule; | |
| DOI : 10.1016/j.jpowsour.2017.08.061 | |
| 来源: Elsevier | |
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【 摘 要 】
In order to fabricate highly efficient polymer solar cells (PSCs) in industrial scale, one of the key issues is to use thick active layer (>200 nm) in the device module without sacrificing the power conversion efficiency (PCE). In this article, we have studied the blend of the medium-bandgap polymeric donor P3HT and the low-bandgap acceptor IDTIDT-IC as the active layer in non-fullerene PSCs, and successfully maintained the device performance with the thickness of the active layer close to 250 nm. The P3HT:IDTIDT-IC based PSCs with simple thermal annealing exhibits a PCE of 3.49% at a thin active layer, 74 nm. More importantly, the PCE remains almost constant with increasing the thickness of the active layer, and reaches a peak value of 3.64% at 236 nm. This thickness-insensitive photovoltaic performance of the P3HT:IDTIDT-IC system makes them compatible with large-scale roll-to-roll processing. Furthermore, the P3HT:IDTIDT-IC devices show a very high tolerance to temperature, and the PCE keeps nearly unchanged after annealing the active layer at 150 degrees C for 75 min. All in all, our results show that thickness-tolerable and thermal-stable P3HT:IDTIDT-IC system is more suitable for large-scale industrial manufacturing than the classic P3HT:PCBM formula. (C) 2017 Elsevier B.V. All rights reserved.
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| 10_1016_j_jpowsour_2017_08_061.pdf | 915KB |
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