Evaluation of local strain evolution from metallic whisker formation

SCRIPTA MATERIALIA

卷:65

Article

Sun, Yong²  Hoffman, Elizabeth N.¹  Lam, Poh-Sang¹  Li, Xiaodong² 

[1] Savannah River Natl Lab, Aiken, SC 29808 USA

[2] Univ S Carolina, Dept Mech Engn, Columbia, SC 29202 USA

关键词: Coatings;    Lead-free solder;    Metallic whiskers;    Digital image correlation;    Thin films;   

DOI  :  10.1016/j.scriptamat.2011.05.007

来源: Elsevier

【 摘 要 】

The evolution of local strain on electrodeposited tin films upon aging has been monitored by digital image correlation (DIC) for the first time. Maps of principal strains adjacent to whisker locations were constructed by comparing pre- and post-growth scanning electron microscopy images. Results showed that the magnitude of the strain gradient plays an important role in whisker growth. DIC visualized the dynamic growth process in which the alteration of strain field has been identified as causing growth of subsequent whiskers. (C) 2011 Published by Elsevier Ltd. on behalf of Acta Materialia Inc.

【 授权许可】

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