Analytical approach for describing the collapse of surface asperities under compressive stress during rapid solid state bonding

SCRIPTA MATERIALIA

卷:128

Article

Chen, Gaoqiang^1,2,3  Feng, Zhili³  Chen, Jian³  Liu, Lei^1,2  Li, Han^1,2  Liu, Qu^1,2  Zhang, Shuai^1,2  Cao, Xiong^1,2  Zhang, Gong^1,2  Shi, Qingyu^1,2 

[1] Tsinghua Univ, Dept Mech Engn, State Key Lab Tribol, Beijing 100084, Peoples R China

[2] Tsinghua Univ, Dept Mech Engn, Key Lab Adv Mat Proc Technol, Beijing 100084, Peoples R China

[3] Oak Ridge Natl Lab, Mat Sci & Technol Div, Oak Ridge, TN 37831 USA

关键词: Solid state bonding;    Surface asperities;    Plastic deformation;    Strain rate;   

DOI  :  10.1016/j.scriptamat.2016.10.015

来源: Elsevier

【 摘 要 】

Many material manufacturing technologies, such as friction stir welding, rely on rapid solid state bonding to join metal surfaces. In this letter, a differential equation is developed to formulate the growing of the interfacial bonded area owing to the collapse of surface asperities under compressive stress during rapid solid state bonding of metal surfaces. The effect of pressure, temperature and bonding time on the growing of bonded area is discussed. The proposed approach is verified by experimental data. (C) 2016 Acta Materialia Inc Published by Elsevier Ltd. All rights reserved.

【 授权许可】

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