A new densification mechanism of copper powder sintered under an electrical field

SCRIPTA MATERIALIA

卷:99

Article

Huang, Kunlan¹  Yang, Yi¹  Qin, Yi²  Yang, Gang¹  Yin, Deqiang¹ 

[1] Sichuan Univ, Sch Mfg Sci & Engn, Chengdu 610065, Sichuan, Peoples R China

[2] Univ Strathclyde, Ctr MicroMfg, Dept DMEM, Glasgow G1 1XQ, Lanark, Scotland

关键词: Electric-field-activated sintering;    Micro-FAST;    Copper powder;    Grain joining;    Grain refinement;   

DOI  :  10.1016/j.scriptamat.2014.12.002

来源: Elsevier

【 摘 要 】

A new sintering mechanism is revealed for copper powder sintered under the influence of an electrical field and a force field during the formation of microcomponents. Analysis of the microstructure and grain boundary evolution of the sintered samples showed that the disappearance of the interface at contact areas between particles is a continuous process which involves new grain formation and grain refinement during this innovative microsintering process. The densification process is therefore different from what is known in a conventional powder sintering process. (C) 2014 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

【 授权许可】

Free