Three-dimensional hierarchical nanoporous copper via direct ink writing and dealloying

SCRIPTA MATERIALIA

卷:177

Article

Mooraj, Shahryar¹  Welborn, Samuel S.^2,5  Jiang, Shuyang^1,3  Peng, Siyuan¹  Fu, Jintao²  Baker, Sarah⁴  Duoss, Eric B.⁴  Zhu, Cheng⁴  Detsi, Eric^2,5  Chen, Wen¹ 

[1] Univ Massachusetts, Dept Mech & Ind Engn, Amherst, MA 01003 USA

[2] Univ Penn, Dept Mat Sci & Engn, 3231 Walnut St, Philadelphia, PA 19104 USA

[3] Smith Coll, Northampton, MA 07063 USA

[4] Lawrence Livermore Natl Lab, 7000 East Ave, Livermore, CA 94550 USA

[5] VIEST, Philadelphia, PA 19104 USA

关键词: 3D printing;    Additive manufacturing;    Direct ink writing;    Hierarchical nanoporous Cu;    Dealloying;   

DOI  :  10.1016/j.scriptamat.2019.10.013

来源: Elsevier

【 摘 要 】

Three-dimensional (3D) hierarchical nanoporous Cu (3DHNP-Cu) is synthesized using a combination of direct ink writing (DIW) based 3D printing, thermal sintering, and chemical dealloying of Mn-Cu alloys. Through tuning processing conditions such as ink composition and cooling rate (after sintering), with consideration of Mn loss during sintering, 3DHNP-Cu with fully bicontinuous nanostructures and negligible residual Mn can be produced after dealloying. The 3DHNP-Cu is comprised of structural features that span seven orders of magnitude, where DIW digitally controls macroscale porous features, thermal sintering and degradation of the binding polymer determines microscale porous features, and dealloying gives rise to nanoscale pores. (C) 2019 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

【 授权许可】

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