Improved electro-mechanical performance of gold films on polyimide without adhesion layers

SCRIPTA MATERIALIA

卷:102

Article

Putz, Barbara^1,2  Schoeppner, Rachel L.³  Glushko, Oleksandr²  Bahr, David F.^3,4  Cordill, Megan J.² 

[1] Montan Univ Leoben, Dept Mat Phys, A-8700 Leoben, Austria

[2] Austrian Acad Sci, Erich Schmid Inst Mat Sci, A-8700 Leoben, Austria

[3] Washington State Univ, Sch Mech & Mat Engn, Pullman, WA 99164 USA

[4] Purdue Univ, Sch Mat Engn, W Lafayette, IN 47907 USA

关键词: Thin films;    Mechanical properties;    Electrical resistivity;    Fracture;    Fragmentation;   

DOI  :  10.1016/j.scriptamat.2015.02.005

来源: Elsevier

【 摘 要 】

Thin metal films on polymer substrates are of interest for flexible electronic applications and often utilize a thin interlayer to improve adhesion of metal films on flexible substrates. This work investigates the effect of a 10 nm Cr interlayer on the electro-mechanical properties of 50 nm Au films on polyimide substrates. Ex situ and in situ fragmentation experiments reveal the Cr interlayer causes brittle electro-mechanical behaviour, and thin Au films without an interlayer can support strains up to 15% without significantly degrading electrical conductivity. (C) 2015 Acta Materialia Inc. Published by Elsevier Ltd.

【 授权许可】

Free