Interplay between bond breaking and plasticity during fracture at a nanomolecularly-modified metal-ceramic interface

SCRIPTA MATERIALIA

卷:121

Article

Kwan, Matthew¹  Braccini, Muriel^1,2  Jain, Ashutosh¹  Lane, Michael W.³  Ramanath, Ganpati¹ 

[1] Rensselaer Polytech Inst, Dept Mat Sci & Engn, Troy, NY 12180 USA

[2] CNRS, Lab Sci & Ingn Mat & Proc SIMAP, F-38000 Grenoble, France

[3] Emory & Henry Coll, Dept Chem, Emory, VA 24327 USA

关键词: Fracture;    Plasticity;    Interfaces;    Self-assembly;    Organosilane;   

DOI  :  10.1016/j.scriptamat.2016.04.034

来源: Elsevier

【 摘 要 】

We reveal the roles of moisture and temperature on the interplay between interfacial work of adhesion gamma(a) and metal plasticity gamma(p) for copper-silica interfaces modified with an organosilane nanolayer. We find that gamma(p) not equal 0 for interfaces with metal thicknesses h(cu) > 12 nm, and increases with ha, before it saturates at h(cu) similar to 165 nm. For a fixed h(cu), gamma(p) increases due to temperature-induced yield stress decrease despite a decrease in gamma(a) with temperature because of water-induced siloxane bond weakening. These findings should be valuable for understanding the fracture mechanics of, and designing, nanomolecularly-functionalized interfaces subject to thermomechanical and chemical stresses. (C) 2016 Elsevier B.V. All rights reserved.

【 授权许可】

Free