Junction growth and interdiffusion during ultrasonic additive manufacturing of multi-material laminates

SCRIPTA MATERIALIA

卷:177

Article

Ward, Austin A.¹  Cordero, Zachary C.¹ 

[1] Rice Univ, Mat Sci & NanoEngn, Houston, TX 77005 USA

关键词: Ultrasonic additive manufacturing;    Dissimilar metal welding;    Intermetallics;    Solid-phase welding;   

DOI  :  10.1016/j.scriptamat.2019.10.004

来源: Elsevier

【 摘 要 】

Ultrasonic additive manufacturing is a promising approach for making net-shaped multi-material laminates from material combinations difficult to process with fusion-based additive manufacturing techniques. The properties of these multi-material laminates depend sensitively on the interface between the constituents, which can be decorated with pores as well as thin intermetallic layers. Here, we develop process models for junction growth and interdiffusion during ultrasonic additive manufacturing of dissimilar metals. These process models are validated against published experimental data, then used to generate process diagrams which reveal that high normal loads and high sonotrode velocities can reduce intermetallic growth while maintaining strong interlayer bonding. (C) 2019 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

【 授权许可】

Free