A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads

SCRIPTA MATERIALIA

卷:61

Article

Xu, H.¹  Liu, C.¹  Silberschmidt, V. V.¹  Pramana, S. S.²  White, T. J.²  Chen, Z.² 

[1] Univ Loughborough, Wolfson Sch Mech & Mfg Engn, Loughborough LE11 3TU, Leics, England

[2] Nanyang Technol Univ, Sch Mat Sci & Engn, Singapore 639798, Singapore

关键词: Thermosonic bonding mechanism;    Interfacial structure;    Intermetallic compounds;   

DOI  :  10.1016/j.scriptamat.2009.03.034

来源: Elsevier

【 摘 要 】

The nanoscale interfacial characteristics of thermosonic copper ball bonding on aluminium metallization were investigated. it was found that ultrasonic vibration swept oxides of aluminium and copper from parts of the contact area, promoting the formation of intermetallic compound Al2Cu (approx.20 nm thick). Where oxides persisted, an amorphous aluminium oxide layer connected with a crystalline copper oxide. It was estimated that ultrasonic vibration caused an effective local temperature increase to 465 degrees C that accelerated interdiffusion and enhanced the formation of Cu-Al intermetallics. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

【 授权许可】

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