Investigation into the effects of magnetic agitation and pulsed current on the development of Sn-Cu alloy electrodeposits

THIN SOLID FILMS

卷:683

Article

Wu, Liang¹  Cobley, Andrew J.¹ 

[1] Coventry Univ, Inst Future Transport & Cities, Coventry CV1 5FB, W Midlands, England

关键词: Tin-copper alloy;    Electrodeposition;    Thin films;    Pulsed current;    Tin whiskers;   

DOI  :  10.1016/j.tsf.2019.05.041

来源: Elsevier

【 摘 要 】

Sn-Cu alloy electrodeposits have found a wide range of applications in the electronics, automotive and aerospace industries. In the current research, the electrodeposition of Sn-Cu alloy coatings produced from an electrolyte based on fluoroboric acids was thoroughly studied. The cathode current density was found to have a significant impact on the appearance and the surface morphology of Sn-Cu alloy electrodeposits. Our experimental results suggested that deposition current density, magnetic agitation and pulsed current parameters (pulse frequency and duty cycle) were all found to be crucial factors significantly affecting the chemical composition of the Sn-Cu alloy electrodeposits. In addition, the employment of pulsed current techniques significantly improved the edge effect and the surface roughness. Whisker growth on the Sn-Cu alloy electrodeposits was assessed. All the samples subjected to different electroplating condition were prone to develop Sn whiskers after a few weeks of storage at room temperature.

【 授权许可】

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