Electro-deposition as a repair method for embedded metal grids

THIN SOLID FILMS

卷:603

Article

Oostra, A. Jolt¹  Reddy, Anil²  Smits, Edsger C. P.²  Abbel, Robert²  Groen, Wilhelm A.²  Blom, Paulw. M.³  Michels, Jasper J.^2,3 

[1] Univ Groningen, Zernike Inst Adv Mat, Nijenborgh 4, NL-9747 AG Groningen, Netherlands

[2] Holst Ctr TNO, High Tech Campus 31, NL-5605 KN Eindhoven, Netherlands

[3] Max Planck Inst Polymer Res, Ackermannweg 10, D-55128 Mainz, Germany

关键词: Repair;    Electromigration;    Metal grid;    Organic light emitting diodes;    Organic photovoltaics;    Devices;   

DOI  :  10.1016/j.tsf.2016.01.060

来源: Elsevier

【 摘 要 】

A method is presented to self-repair cracks in embedded silver grid structures used in large area organic electronics. The repair procedure is based on electro-deposition, incited by the application of a moderate DC voltage across the crack. During this process the organic anode that is in direct electrical contact with the silver grid, functions as an appropriate medium for ion migration. Restoration of conductivity is achieved by the formation of dendritic metal structures that connect the cathodic to the anodic side of the crack. The metal dendrites decrease the gap resistance by one order of magnitude. Subsequently, another three orders of magnitude are gained upon sintering the dendrites using a high voltage pulse, yielding restored conductance levels nearly within one order of magnitude difference from native track conductance. (C) 2016 Elsevier B.V. All rights reserved.

【 授权许可】

Free