Electrodeposition of Re-Ni alloys from aqueous solutions with organic additives

THIN SOLID FILMS

卷:616

Article

Wu, Wangping¹  Eliaz, Noam¹  Gileadi, Eliezer² 

[1] Tel Aviv Univ, Fac Engn, Dept Mat Sci & Engn, Biomat & Corros Lab, IL-6997801 Tel Aviv, Israel

[2] Tel Aviv Univ, Fac Exact Sci, Sch Chem, IL-6997801 Tel Aviv, Israel

关键词: Electrodeposition;    Bath additives;    Nickel;    Rhenium;    Surface cracking;   

DOI  :  10.1016/j.tsf.2016.10.012

来源: Elsevier

【 摘 要 】

In this study, Re-Ni alloys with high Re content were electrodeposited on copper substrates from aqueous solutions containing additives with a combination of vanillin, sodium lauryl sulfate and gelatin. The bath additives were found to have a significant effect on the chemical composition, surface morphology and cracking pattern. The morphology of the alloy was changed from uniformly smooth without additives to relatively coarse-grained with three additives. The deposition rate and crack density decreased when additives were added to a bath containing 34 mM ReO4-, 124 mM Ni2+ and 343 mM [Cit](3-). Almost pure Re films were formed at low Ni2+ concentration of 30-50 mM due to the effect of additives; however, the deposited film was thin. A thin layer of Re oxide, a new Re-O-C-complex state and some organic residues from additives were formed at the surface of the Re film. Both the Re-rich alloy and the Re film were found to have an amorphous structure. (C) 2016 Elsevier B.V. All rights reserved.

【 授权许可】

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