Effect of Cu doping on the microstructure and mechanical properties of AlTiVN-Cu nanocomposite coatings

SURFACE & COATINGS TECHNOLOGY

卷:402

Article

Mei, Haijuan^1,2  Geng, Dongsen¹  Wang, Rui¹  Cheng, Lixia²  Ding, Ji Cheng³  Luo, Quanshun⁴  Zhang, Teng Fei¹  Wang, Qimin¹ 

[1] Guangdong Univ Technol, Sch Electromech Engn, Guangzhou, Peoples R China

[2] Huizhou Univ, Guangdong Prov Key Lab Elect Funct Mat & Devices, Huizhou, Peoples R China

[3] Pusan Natl Univ, Sch Convergence Sci, Busan 609735, South Korea

[4] Sheffield Hallam Univ, Mat & Engn Res Inst, Sheffield S1 1WB, S Yorkshire, England

关键词: AlTiVN-Cu;    Microstructure;    Mechanical properties;    Toughness;   

DOI  :  10.1016/j.surfcoat.2020.126490

来源: Elsevier

【 摘 要 】

Cu phase has been incorporated into hard coatings to form nanocomposite structure, which not only enhanced the hardness but also the toughness due to excellent ductility of copper. In this study, a single Al67Ti33-V-Cu spliced target was used to prepare the AlTiVN-Cu nanocomposite coatings, and the effect of Cu doping on microstructure and mechanical properties of AlTiVN-Cu coatings has been investigated. The results showed that the deposition rate linearly increased from 3.8 to 13.4 nm/min when Cu content increased from 2.6 to 46.7 at.%. AlTiVN-Cu coatings exhibited a Ti-Al-V-N solid-solution phase with strong (111) preferred orientation at low Cu contents below 8.3 at.%. When Cu content increased above 22.6 at.%, Cu atoms grew up into metallic crystallites and strongly suppressed crystal growth of nitride coatings due to repeated nucleation. With increasing Cu content, the microstructure transferred from compact columnar to dense featureless, and then to coarse columnar structure. AlTiVN-Cu(2.6 at.%) coating exhibited a super hardness of 41.1 GPa and an excellent toughness with a high H-3/E*(2) ratio of 0.24.

【 授权许可】

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