Torsional stress relaxation behavior of microscale copper wire

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

卷:698

Article

Guo, Song¹  He, Yuming¹  Liu, Dabiao¹  Lei, Jian¹  Li, Zhenkun¹  Ding, Huaming¹ 

[1] Huazhong Univ Sci & Technol, Dept Mech, Wuhan 430074, Peoples R China

关键词: Stress relaxation;    Torsion;    Microscale copper wires;    Activation volume;    Cross-slip;   

DOI  :  10.1016/j.msea.2017.05.044

来源: Elsevier

【 摘 要 】

Torsional stress relaxation behavior of copper wire with a diameter of 50 gm and grain size of 3.7 mu m is experimentally investigated at room temperature. It is revealed that the stress relaxation occurs in both elastic and plastic regions. An elevated stress drop and a reduced apparent activation volume with increasing initial stress levels are also found in both elastic and plastic regions. Extremums of stress drop and activation volume are observed around the elastic limit. Meanwhile, high strain rate and rapidly exhaustive mobile dislocation density are observed. Finally, the cross-slip is considered to be the operating mechanism.

【 授权许可】

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