Effect of surface steps on chemical ordering in the subsurface of Cu(Au) solid solutions

Article

关键词: SEGREGATION PROFILES;    DISORDER;    TRANSITION;    CU3AU;    ADSORPTION;    INTERPLAY;    KINETICS;    BEHAVIOR;    ALLOYS;    MODEL;   

DOI  :  10.1103/PhysRevB.103.035401

来源: SCIE

【 摘 要 】

Atomic steps are typically assumed to only influence surface phenomena of solids. In contrast, here we show, using in situ atomic-resolution electron microscopy observations and atomistic modeling, the pronounced effect from surface steps in inducing compositional and structural evolution in the subsurface of a Cu(Au) solid solution. We find that Au surface segregation results in a stacked sequence of Cu-Au ordered phases in the subsurface. The presence of a monatomic step at the surface induces the formation of an antiphase boundary that extends from the surface step to deeper layers by maintaining the same composition profile associated with each terrace. The bunching of surface steps induces chemical disordering of the Cu-Au ordered phases in the subsurface region of the bunched steps. These results demonstrate the instant propagation of surface dynamics of atomic steps into the subsurface region and can find broader applicability in utilizing surface defects to tune the composition and structure in the subsurface of alloys.

【 授权许可】

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