Thermal interface conductance across metal alloy-dielectric interfaces

Article

关键词: TIME-DOMAIN THERMOREFLECTANCE;    LATTICE-DYNAMICS;    BOUNDARY CONDUCTANCE;    CRYSTAL DYNAMICS;    HEAT-FLOW;    CONDUCTIVITY;    ELECTRON;    PALLADIUM;    COPPER;    TRANSDUCER;   

DOI  :  10.1103/PhysRevB.93.035309

来源: SCIE

【 摘 要 】

We present measurements of thermal interface conductance as a function of metal alloy composition. Composition spread alloy films of AuxCu1-x and AuxPd1-x solid solutions were deposited on single crystal sapphire substrates via dual electron-beam evaporation. High throughput measurements of thermal interface conductance across the (metal alloy)-sapphire interfaces were made by positional scanning of frequency domain thermoreflectance measurements to sample a continuum of Au atomic fractions (x similar to 0 -> 1). At a temperature of 300 K, the thermal interface conductance at the AuxCu1-x-sapphire interfaces monotonically decreased from 197 +/- 39 MW m(-2) K-1 to 74 +/- 11 MW m(-2) K-1 for x = 0 -> 0.95 +/- 0.02 and at the AuxPd1-x-sapphire interfaces from 167 +/- 35 MW m(-2) K-1 to 60 +/- 10 MW m(-2) K-1 for x = 0.03 -> 0.97 +/- 0.02. To shed light on the phonon physics at the interface, a Diffuse Mismatch Model for thermal interface conductance with alloys is presented and agrees reasonably with the thermal interface conductance data.

【 授权许可】

Free