Silver Nanoparticle-Deposited Aluminum Oxide Nanoparticle as Fillers for Epoxy Composites with High Thermal Conductivity

Advanced Composites Letters

Article

Gang Zhang¹  Tao Huang¹  Fanling Meng²  Yimin Yao³ 

[1] College of Information & Technology, Jilin Normal University, Siping, 136000, China.;Key Laboratory of Automobile Materials of Ministry of Education, College of Materials Science and Engineering, Jilin University, Changchun 130012, China.;Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences. Shenzhen, 518055, China.; Shenzhen College of Advanced Technology, University of Chinese Academy of Sciences, China.;

关键词: Thermal conductivity;    Aluminum nitride;    Epoxy;    Silver nanoparticle;    Dielectric properties;   

DOI  :  10.1177/096369351802700601

 received in 2018-05-04, accepted in 2018-07-16,  发布年份 2018

来源: Sage Journals

【 摘 要 】

With the development of polymer-filled composites, the demand of high thermal conductivity materials is much attractive than ever. However, the process of a common method to improve thermal conductivity of composites is considerably complicated. The aim of this study is to investigate thermal conductivity of epoxy filled silver nanoparticle deposited aluminum nitride nanoparticles with relatively convenient process. We found that the thermal conductivities of composites filled with AlN/Ag nanoparticles are effectively enhanced, which is enormously increased from 0.48 Wm-1K-1(1.88 vol%) to 3.66 Wm-1K-1 (19.54 vol%). This can be ascribed to the bridging connections of silver nanoparticle among aluminum nitride nanoparticles. In addition, the thermal contact resistance of the epoxy composites filler with AlN/Ag nanoparticles is decreased, which is proved by the fitting measured thermal conductivity of epoxy composite with one physical model. We believe the finding has great potential for any microelectronic application.

【 授权许可】

Unknown   
© 2018 SAGE Publications Ltd

【 图 表 】

Figure 4.