期刊论文详细信息
Materials
Research on the Single Grit Scratching Process of Oxygen-Free Copper (OFC)
Lan Yan1  Feng Jiang2  Tao Zhang2  Libin Zhang2  Bicheng Guo2 
[1] College of Mechanical Engineering and Automation, National Huaqiao University, Xiamen 361021, China;Institute of Manufacturing Engineering, National Huaqiao University, Xiamen 361021, China;
关键词: single grit scratching;    numerical simulation;    material constitutive model;    material flow;    friction model;    residual stress distribution;   
DOI  :  10.3390/ma11050676
来源: DOAJ
【 摘 要 】

Single grit scratching is a basic form of material removal for many processes, such as grinding single point diamond turning and coating bonding performance tests. It has been widely used in the study of micro-scale and nano-scale material removal mechanisms. In this study, single grit linearly loading scratching tests were carried out on a scratching tester. A Rockwell indenter made of natural diamond was selected as the tool used, and the material of the workpiece was oxygen-free copper. Scratch topography was measured using a super-depth microscope to analyze the material deformation of the scratching process. A single grit scratching simulation has been developed by AdvantEdge™ to comprehensively study the material deformation of scratching processes. A material constitutive model and friction model were acquired using a quasi-static uniaxial compression experiment and a reciprocating friction test, respectively. These two models were used as the input models in the finite simulations. The simulated scratching forces aligned well with the experimental scratching forces, which verified the precision of the simulation model. Since only the scratching force could be obtained in the scratching experiment, the plastic strain, material flow, and residual stress of the scratching were further analyzed using simulations. The results showed that the plastic strain of the workpiece increased with the increase in scratching depth, and further analysis showed that the workpiece surface was distributed with residual compressive stress and the sub-surface was distributed with residual tensile stress in single grit scratching.

【 授权许可】

Unknown   

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