Unshrouded Plate Fin Heat Sinks for Electronics Cooling: Validation of a Comprehensive Thermal Model and Cost Optimization in Semi-Active Configuration

Energies

Vincenzo Pugliese¹  Saverio Fotia¹  Matteo Fasano²  Pietro Asinari²  Eliodoro Chiavazzo²  Luigi Ventola²  Gabriele Curcuruto² 

[1] DENSO Thermal Systems, 10046 Poirino (TO), Italy;Energy Department, Politecnico di Torino, Corso Duca degli Abruzzi 24, 10129 Torino (TO), Italy;

关键词: heat transfer enhancement;    electronics cooling;    plate fin heat sinks;    cost optimization;    genetic algorithms;   

DOI  :  10.3390/en9080608

来源: DOAJ

【 摘 要 】

Plate Fin Heat Sinks (PFHS) are among the simplest and most widespread devices for electronics cooling. Because of the many design parameters to be considered, developing both cost and thermal effective PFHS is a critical issue. Here, a novel thermal model of PFHS is presented. The model has a broad field of applicability, being comprehensive of the effects of flow bypass, developing boundary layers, fin efficiency and spreading resistance. Experiments are then carried out to validate the proposed thermal model, and its good accuracy is demonstrated. Finally, an optimization methodology based on genetic algorithms is proposed for a cost-effective selection of the design parameters of PFHS, which is particularly effective with semi-active configurations. Such an optimization methodology is then tested on a commercial heat sink, resulting in a possible 53% volume reduction at fixed thermal performances.

【 授权许可】

Unknown