3D Rapid-Prototyped 21-31-GHz Hollow SIWs for Low-Cost 5G IoT and Robotic Applications

IEEE Access

Ulrik Imberg¹  Nattapong Duangrit²  Nutapong Somjit³  Nonchanutt Chudpooti⁴  Giorgos Savvides⁵  Ian D. Robertson⁶  Prayoot Akkaraekthalin⁶ 

[1] Department of Electrical and Computer Engineering, Faculty of Engineering, King Mongkut&x2019;Faculty of Engineering, Rajamangala University of Technology Lanna, Chiang Mai, Thailand;Huawei Technologies Sweden AB, Kista, Sweden;Research Center of Innovation Digital and Electromagnetic Technology (iDEMT), Department of Industrial Physics and Medical Instrumentation, Faculty of Applied Science, King Mongkut&x2019;School of Electronic and Electrical Engineering, University of Leeds, Leeds, U.K.;s University of Technology North Bangkok, Bangkok, Thailand;

关键词: Substrate integrated waveguide;    millimeter waves;    additive manufacturing;   

DOI  :  10.1109/ACCESS.2021.3051180

来源: DOAJ

【 摘 要 】

This article presents, for the first time, new design and fabrication techniques for Hollow Substrate Integrated Waveguides (HSIWs), demonstrated in the nominal frequency from 21 to 31 GHz, for use in wireless communication applications such as 5G, IoT and robotics. The design and fabrication techniques introduced in this paper feature: 1) the use of low-cost rapid prototyping additive manufacturing based on polymer jetting (PJ), and 2) the use of commercially available through-substrate copper via transitions. In contrast to the conventional SIW designs and fabrications, this new approach does not rely on through-substrate via fabrication, hence avoiding some difficult manufacturing steps, such as through-substrate etching, via formation and via metallization, which are considered complex and expensive to implement. The 3D printed HSIWs in this article can achieve a propagation loss of lower than 1.56 Np/m (13.55 dB/m), which is considered one of the results with the lowest propagation loss achieved to date, when compared to the state-of-the-art.

【 授权许可】

Unknown