Dielectric, mechanical and thermal properties of all-organic PI/PSF composite films by in situ polymerization

e-Polymers

Jiang Shaohua¹  Yu Jiajun²  Fang Hong²  Hou Haoqing²  Li Peng²  Liu Kunming³ 

[1] Co-Innovation Center of Efficient Processing and Utilization of Forest Resources, College of Materials Science and Engineering, Nanjing Forestry University, Nanjing 210037, China;College of Chemistry and Chemical Engineering, Jiangxi Normal University, Nanchang 330022, China;School of Metallurgical and Chemical Engineering, Jiangxi University of Science and Technology, Ganzhou 341000, China;

关键词: polysulfone;    polyimide;    dielectric properties;    mechanical properties;    thermal properties;   

DOI  :  10.1515/epoly-2020-0020

来源: DOAJ

【 摘 要 】

All-organic high dielectric materials are highly required in the field of modern electronic industry and energy storage. In this work, all-organic polyimide/polysulfone composite films with different amounts of PSF (PI/PSF-X) were prepared by in situ polymerization followed by film casting and thermal treatment. The dielectric, mechanical and thermal properties of these PI/PSF-X composite films are characterized by dielectric measurement, tensile test, thermogravimetric analysis and dynamic mechanical analysis. The results suggest that the PI/PSF-X composite films have good dielectric properties, good mechanical properties and excellent thermal properties, which are suitable for applications in electronic devices in harsh environments, especially in high-temperature environments.

【 授权许可】

Unknown