Nanomaterials | |
Enhanced Thermal Conductivity of Polymer Composite by Adding Fishbone-like Silicon Carbide | |
Jian Yi1  Linhong Li1  Xianzhe Wei1  Nan Jiang1  Yue Qin1  Jinhong Yu1  Tao Cai1  Shaoyang Xiong1  Maohua Li1  Cheng-Te Lin1  Xiangdong Kong1  Wen Dai1  Juncheng Xia2  Shuangquan Fang2  | |
[1] Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China;School of Mechanical Engineering, Yangzhou University, Yangzhou 225009, China; | |
关键词: silicon carbide; polyvinylidene fluoride; thermal conductivity; electronic packaging; | |
DOI : 10.3390/nano11112891 | |
来源: DOAJ |
【 摘 要 】
The rapid development of chip technology has all put forward higher requirements for highly thermally conductive materials. In this work, a new type of material of Fishbone-like silicon carbide (SiC) material was used as the filler in a polyvinylidene fluoride (PVDF) matrix. The silicon carbide/polyvinylidene fluoride (SiC/PVDF) composites were successfully prepared with different loading by a simple mixing method. The thermal conductivity of SiC/PVDF composite reached 0.92 W m−1 K−1, which is 470% higher than that of pure polymer. The results show that using the filler with a new structure to construct thermal conductivity networks is an effective way to improve the thermal conductivity of PVDF. This work provides a new idea for the further application in the field of electronic packaging.
【 授权许可】
Unknown