Enhanced Thermal Conductivity of Polymer Composite by Adding Fishbone-like Silicon Carbide

Nanomaterials

Jian Yi¹  Linhong Li¹  Xianzhe Wei¹  Nan Jiang¹  Yue Qin¹  Jinhong Yu¹  Tao Cai¹  Shaoyang Xiong¹  Maohua Li¹  Cheng-Te Lin¹  Xiangdong Kong¹  Wen Dai¹  Juncheng Xia²  Shuangquan Fang² 

[1] Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China;School of Mechanical Engineering, Yangzhou University, Yangzhou 225009, China;

关键词: silicon carbide;    polyvinylidene fluoride;    thermal conductivity;    electronic packaging;   

DOI  :  10.3390/nano11112891

来源: DOAJ

【 摘 要 】

The rapid development of chip technology has all put forward higher requirements for highly thermally conductive materials. In this work, a new type of material of Fishbone-like silicon carbide (SiC) material was used as the filler in a polyvinylidene fluoride (PVDF) matrix. The silicon carbide/polyvinylidene fluoride (SiC/PVDF) composites were successfully prepared with different loading by a simple mixing method. The thermal conductivity of SiC/PVDF composite reached 0.92 W m⁻¹ K⁻¹, which is 470% higher than that of pure polymer. The results show that using the filler with a new structure to construct thermal conductivity networks is an effective way to improve the thermal conductivity of PVDF. This work provides a new idea for the further application in the field of electronic packaging.

【 授权许可】

Unknown