Pulse Current Assisted TLP Bonding of SiCP/Al Composites Sheet Using Powders Interlayer

Journal of Aeronautical Materials

LAI Xiaoming¹  YI Zhuoxun¹  WANG Bo¹  ZHANG Kaifeng² 

[1] Department of Mechanical and Electronics, Beijing Spacecrafts, Beijing 100094, China;School of Materials Science and Engineering, Harbin Institutes of Technology, Harbin 150001, China;

关键词: TLP bonding;    pulse current heating;    powders interlayer;    Al composites;   

DOI  :  10.11868/j.issn.1005-5053.2016.000142

来源: DOAJ

【 摘 要 】

The powders interlayer was applied for transient liquid phase (TLP) bonding of SiC_p/Al composites using pulse current heating. Pulse current got though the joint with powder interlayer and generated the effect of Joule heat and spark plasma sintering to achieve the TLP bonding of SiC_p/Al composites sheet. The results show that there is the good TLP bonded joint without defects under the conditions of vacuum:1.39×10³ Pa; Pulse current density: 115 A/mm²; holding time: 15-60 min; original pressure: 0.5 MPa. The results reveal the dense joint without pores composed of the Al-based solid solution, pure Ti zone, Al₂Cu, and Al₃Ti intermetallic phase. Furthermore, the thermal and isothermal effects of pulse current on in situ synthesis of TLP bonded joints of SiC_p/Al composites using mixed Al-Cu-Ti powder interlayer are analyzed and discussed. According to microstructure of joint, pulse current promote to in situ form the intermetallic compound, which can provide higher mechanical properties of joint.

【 授权许可】

Unknown