Mini-Review: Modeling and Performance Analysis of Nanocarbon Interconnects

Applied Sciences

Meng Li¹  Da-Wei Wang²  Wen-Yan Yin²  Wen-Sheng Zhao³  Kai Fu³  Gaofeng Wang³ 

[1] Beijing Aerospace Technology Institute, Beijing 100074, China;Key Lab of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province, College of Information Science and Electronic Engineering, Innovative Institute of Electromagnetic Information and Electronic Integration, Zhejiang University, Hangzhou 310058, China;Key Lab of RF Circuits and Systems of Ministry of Education, School of Electronics and Information, Hangzhou Dianzi University, Hangzhou 310018, China;

关键词: carbon nanotube (CNT);    graphene nanoribbon (GNR);    circuit modeling;    interconnects;    nanocarbon;    electrothermal co-simulation;   

DOI  :  10.3390/app9112174

来源: DOAJ

【 摘 要 】

As the interconnect delay exceeds the gate delay, the integrated circuit (IC) technology has evolved from a transistor-centric era to an interconnect-centric era. Conventional metallic interconnects face several serious challenges in aspects of performance and reliability. To address these issues, nanocarbon materials, including carbon nanotube (CNT) and graphene, have been proposed as promising candidates for interconnect applications. Considering the rapid development of nanocarbon interconnects, this paper is dedicated to providing a mini-review on our previous work and on related research in this field.

【 授权许可】

Unknown