Validation of Forward Voltage Method to Estimate Cracks of the Solder Joints in High Power LED

Electronics

Paola Pierleoni¹  Lorenzo Palma¹  Alberto Belli¹  Federica Pinti¹  Massimo Gattari² 

[1] Department of Information Engineering (DII), Università Politecnica delle Marche, 60131 Ancona, Italy;iGuzzini Illuminazione S.p.A, Via Mariano Guzzini 37, 62019 Recanati, Italy;

关键词: LED;    thermal cycling test;    accelerated test;    solder joint;    cracks;   

DOI  :  10.3390/electronics9060920

来源: DOAJ

【 摘 要 】

The Light Emitting Diode (LED) has many advantages compared to traditional lamps, such as a long lifetime, color rendering and energy saving. It requires good thermal management, since as the temperature increases, the lifetime decreases. Furthermore, the presence of cracks in the Solder Joint of an LED (SJL) compromises the correct dispersion of heat and causes the joint fatigue. This can lead to a decrease in the lifetime of the assembled LED. In this study, we validated that an SJL can be considered faulty if the Forward Voltage (Vf) acquired before and after thermal cycles increases by more than 2%. The voltage measurement method was validated by comparing the results with the techniques commonly used to evaluate the defects of a solder joint as the X-ray analysis and the metallographic section. The failure analysis results present the probability of failure and the lifetime of the SJL achieved by analyzing the data using the Norris–Landberg Model. The lifetime calculated over 1800 SJLs considered in the validation process is greater than 20 years for 95.9% of the tested LEDs.

【 授权许可】

Unknown